Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-03-06
2007-03-06
Reichard, Dean A. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000, C361S761000, C361S763000
Reexamination Certificate
active
11031508
ABSTRACT:
Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.
REFERENCES:
patent: 5010641 (1991-04-01), Sisler
patent: 5079069 (1992-01-01), Howard et al.
patent: 6663946 (2003-12-01), Seri et al.
patent: 2004/0150966 (2004-08-01), Hu
patent: 2004/0231885 (2004-11-01), Borland et al.
Kim Jin Cheol
Kim Min Soo
Kim Tae Kyoung
Oh Jun Rok
Darby & Darby
Reichard Dean A.
Samsung Electro-Mechanics Co. Ltd.
Semenenko Yuriy
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