Cleaning method and polishing apparatus employing such...

Details Cleaning method and polishing apparatus employing such... Cleaning method and polishing apparatus employing such...

2007-01-30

2007-01-30

Carrillo, Sharidan (Department: 1746)

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

C134S002000, C134S006000, C134S026000, C134S028000, C134S029000, C134S034000, C134S036000, C134S041000, C134S902000, C451S060000, C451S285000, C451S287000

Reexamination Certificate

active

10844317

ABSTRACT:
A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

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