Tuned MMIC probe pads

Details Tuned MMIC probe pads Tuned MMIC probe pads

2007-04-10

2007-04-10

Benson, Walter (Department: 2858)

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

C324S633000

Reexamination Certificate

active

11460311

ABSTRACT:
A microwave integrated circuit chip having microwave transmission line coupled to an input of a microwave circuitry: The microwave transmission line comprises: a substrate; a strip conductor disposed on a first surface of the substrate, such strip conductor having an input signal pad at one end thereof, and a ground plane disposed on a second, opposite surface of the substrate. The microwave circuitry has capacitive input impedance. The chip includes a via passing from the first surface of the substrate, through the substrate, to the ground plane. A test probe ground pad is disposed on the first surface of the substrate and spaced from a portion of the via disposed on the first surface of the substrate. An electrical conductor is disposed on the first surface of the substrate extending from the portion of the via disposed on the first surface of the substrate via to the test probe ground pad, such electrical conductor providing an inductive impedance selected to provide a resonance with the capacitive input impedance of the microwave circuitry.

REFERENCES:
patent: 4719434 (1988-01-01), Scott et al.
patent: 5351001 (1994-09-01), Kornrumpf et al.
patent: 5457399 (1995-10-01), Krumm
patent: 6049219 (2000-04-01), Hwang et al.

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