Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-09-11
2007-09-11
Dinh, Tuan T. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S250000, C174S255000, C174S263000, C174S256000, C174S261000, C361S760000, C361S767000, C361S779000, C257S737000, C257S738000, C257S778000, C257S786000, C257S780000
Reexamination Certificate
active
10682780
ABSTRACT:
In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board includes a pad for mounting the ball grid array, a wiring for connecting the pad and an external terminal, and a soldering resist having an opening portion exposing the pad and the wiring.
REFERENCES:
patent: 5834848 (1998-11-01), Iwasaki
patent: 6050481 (2000-04-01), Chapman et al.
patent: 6059172 (2000-05-01), Chapman et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6204559 (2001-03-01), Lin et al.
patent: 6239383 (2001-05-01), Lin
patent: 6291899 (2001-09-01), Wensel et al.
patent: 6387731 (2002-05-01), Wensel et al.
patent: 6388335 (2002-05-01), Lam
patent: 6431432 (2002-08-01), McCormick et al.
patent: 6570259 (2003-05-01), Alcoe et al.
patent: 6622380 (2003-09-01), Grigg
patent: 6667557 (2003-12-01), Alcoe et al.
patent: 6812410 (2004-11-01), Sakamoto et al.
patent: 6906425 (2005-06-01), Stewart et al.
patent: 2001/0005050 (2001-06-01), Ohsawa et al.
patent: 04-318993 (1992-11-01), None
patent: 10-290058 (1998-10-01), None
patent: 2000-031630 (2000-01-01), None
patent: 2000-298352 (2000-10-01), None
patent: 2002-134555 (2002-05-01), None
patent: 1999-0045687 (1999-06-01), None
patent: 2002-0059851 (2002-07-01), None
Communication from Korean Patent Office regarding related application.
Communication from Japanese Patent Office regarding corresponding application.
Dinh Tuan T.
Nguyen Hoa C
Seiko Epson Corporation
LandOfFree
Circuit board, mounting structure of ball grid array,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit board, mounting structure of ball grid array,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit board, mounting structure of ball grid array,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3769952