Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2007-04-24

2007-04-24

Booth, Richard (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

C257S723000, C257S724000, C257S666000, C257S667000, C438S107000, C438S125000, C438S126000, 43, 43

Reexamination Certificate

active

09821361

ABSTRACT:
Die pads50, 51,an external connecting electrode52and a bridge are covered with an insulating resin after half-etching, formed into a single package without a coupling member such as a supporting lead or adhesive tape. In addition, since no supporting board is required, a low-profile semiconductor device with improved heat radiation can be provided.

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