Apparatus and method for inspecting soldering condition of elect

Details Apparatus and method for inspecting soldering condition of elect Apparatus and method for inspecting soldering condition of elect

1995-04-21

1996-06-04

Williams, Hezron E.

Measuring and testing

Vibration

By mechanical waves

73602, G01B 1700

Patent

active

055222633

ABSTRACT:
A measuring device 40 measures an ultrasonic waveform provided to an inspection tool 1. A target energy memory section 45 memorizes a target energy consumed by the inspection tool 1 when the inspection tool 1 is depressed on the soldered portion of an electronic component which is properly soldered on a substrate. A reference waveform memory section 44 memorizes a reference waveform corresponding to an ultrasonic waveform measured in a no load condition of the inspection tool 1. A CPU 43 makes a judgement on whether the soldering condition of the soldered portion of the electronic component is acceptable or not based on a difference between the reference waveform and the waveform measured by the measuring device 40.

REFERENCES:
patent: 4218922 (1980-08-01), Ensminger
patent: 5170929 (1992-12-01), Long
patent: 5291419 (1994-03-01), Satoh

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