High dielectric resin composition

Details High dielectric resin composition High dielectric resin composition

2007-05-29

2007-05-29

Yoon, Tae H (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S430000, C524S431000, C524S604000, C264S212000

Reexamination Certificate

active

10763385

ABSTRACT:
An object of the present invention is to provide a resin composition which is capable of manufacturing a high dielectric resin film having high dielectric constant and small dielectric loss tangent. And the present invention provides high dielectric resin composition comprising:a high dielectric filler; andresin;wherein a relative dielectric constant of the high dielectric filler satisfies the following formulae (1) and (2).in-line-formulae description="In-line Formulae" end="lead"?[(∈T−∈25)/∈25]MAX≦0.03  (1)in-line-formulae description="In-line Formulae" end="tail"?in-line-formulae description="In-line Formulae" end="lead"?40≦∈25≦1000  (2)in-line-formulae description="In-line Formulae" end="tail"?

REFERENCES:
patent: 3442699 (1969-05-01), Dalton
patent: 4473682 (1984-09-01), Calundann et al.
patent: 5739193 (1998-04-01), Walpita et al.
patent: 5922453 (1999-07-01), Horn, et al.
patent: 5962122 (1999-10-01), Walpita et al.
patent: 6838546 (2005-01-01), Okamoto et al.
patent: 7063892 (2006-06-01), Okamoto et al.
Electronic Materials 2002, Sep., pp. 25-29.

Affiliated with

Also associated with

Rating

High dielectric resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High dielectric resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High dielectric resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3760011