Semiconductor chip and method of testing the same

Details Semiconductor chip and method of testing the same Semiconductor chip and method of testing the same

2007-04-10

2007-04-10

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

11349979

ABSTRACT:
A semiconductor chip includes a plurality of pads; a plurality of interface circuits connected with the plurality of pads, respectively; an internal circuit connected with the plurality of interface circuits; and a transfer circuit connecting the plurality of interface circuits with each other in response to a test mode signal. One of the plurality of pads is a selected pad when the pad is probed, at least one remaining pad is a non-selected pad, one of the plurality of interface circuits corresponding to the selected pad is a selected interface circuit, and at least one remaining interface circuit is a non-selected interface circuit. The internal circuit is tested by using the selected pad, the selected interface circuit, the transfer circuit, and the non-selected interface circuit without using the non-selected pads.

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