Metal fusion bonding – Including means to apply flux or filler to work or applicator
Reexamination Certificate
2007-01-09
2007-01-09
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
C228S260000, C228S262000, C239S102200, C347S076000, C347S077000
Reexamination Certificate
active
10616184
ABSTRACT:
A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.
REFERENCES:
patent: 3641588 (1972-02-01), Metz
patent: 4650694 (1987-03-01), Dressler et al.
patent: 4817851 (1989-04-01), Kolesar et al.
patent: 4872905 (1989-10-01), Bourne et al.
patent: 4981249 (1991-01-01), Kawashima et al.
patent: 5226948 (1993-07-01), Orme et al.
patent: 5229016 (1993-07-01), Hayes et al.
patent: 5259593 (1993-11-01), Orme et al.
patent: 5266098 (1993-11-01), Chun et al.
patent: 5364011 (1994-11-01), Baker et al.
patent: 5377961 (1995-01-01), Smith et al.
patent: 5379931 (1995-01-01), Van Schaik
patent: 5411602 (1995-05-01), Hayes
patent: 5455606 (1995-10-01), Keeling et al.
patent: 5481288 (1996-01-01), Keeling et al.
patent: 5520715 (1996-05-01), Oeftering
patent: 5545465 (1996-08-01), Gaynes et al.
patent: 5560543 (1996-10-01), Smith et al.
patent: 5585629 (1996-12-01), Doran et al.
patent: 5597110 (1997-01-01), Melton et al.
patent: 5643353 (1997-07-01), Wallace et al.
patent: 5736074 (1998-04-01), Hayes et al.
patent: 5746844 (1998-05-01), Sterett et al.
patent: 5747102 (1998-05-01), Smith et al.
patent: 5772106 (1998-06-01), Ayers et al.
patent: 5779971 (1998-07-01), Tsung Pan et al.
patent: 5810988 (1998-09-01), Smith, Jr. et al.
patent: 5855323 (1999-01-01), Yost et al.
patent: 5868305 (1999-02-01), Watts, Jr. et al.
patent: 5891212 (1999-04-01), Tang et al.
patent: 5894980 (1999-04-01), Orme-Marmarelis et al.
patent: 5894985 (1999-04-01), Orme-Marmarelis et al.
patent: 5938102 (1999-08-01), Muntz et al.
patent: 5988480 (1999-11-01), Farnworth
patent: 6036777 (2000-03-01), Sachs
patent: 6070973 (2000-06-01), Sachs et al.
patent: 6082605 (2000-07-01), Farnworth
patent: 6186192 (2001-02-01), Orme-Marmarelis et al.
patent: 6202734 (2001-03-01), Sackinger et al.
patent: 6213356 (2001-04-01), Nakasu et al.
patent: 6224180 (2001-05-01), Pham-Van-Diep et al.
patent: 6264090 (2001-07-01), Muntz et al.
patent: 6276589 (2001-08-01), Watts, Jr. et al.
patent: 6325271 (2001-12-01), Farnworth
patent: 6350494 (2002-02-01), Farnworth
patent: 6443350 (2002-09-01), Farnworth
patent: 2001/0048017 (2001-12-01), Farnworth
patent: 2002/0031612 (2002-03-01), Farnworth
patent: 2002/0145030 (2002-10-01), Farnworth
patent: 2004/0026479 (2004-02-01), Farnworth
patent: 1682039 (1991-10-01), None
Micro)n Technology, Inc.
TraskBritt
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