IC coolant microchannel assembly with integrated attachment...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S699000, C361S719000, C165S080400, C257S714000

Reexamination Certificate

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11239957

ABSTRACT:
An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.

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patent: 2006/0096738 (2006-05-01), Kang et al.
patent: 2006/0226539 (2006-10-01), Chang et al.
“PCT International Search Report of the International Searching Authority”, mailed Feb. 19, 2007, for PCT/US2006/037577, 4 pgs.

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