Thin film support substrate for use in hydrogen production...

Details Thin film support substrate for use in hydrogen production... Thin film support substrate for use in hydrogen production...

2007-07-10

2007-07-10

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Etching to produce porous or perforated article

C216S017000, C216S058000, C216S074000, C216S041000, C205S080000, C205S261000, C205S291000

Reexamination Certificate

active

11401868

ABSTRACT:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.

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