Semiconductor device package with reduced leakage

Details Semiconductor device package with reduced leakage Semiconductor device package with reduced leakage

2007-05-29

2007-05-29

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE33075, C257SE33004, C257SE33057, C257S099000, C257S433000, C257S675000, C257S696000, C257S712000, C257S704000, C257S707000, C257S706000, C257S710000, C257S713000, C257S680000, C257S795000, C257S784000, C257S786000

Reexamination Certificate

active

11015534

ABSTRACT:
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewalls interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.

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