Electronic component with bump electrodes, and manufacturing...

Details Electronic component with bump electrodes, and manufacturing... Electronic component with bump electrodes, and manufacturing...

2007-03-13

2007-03-13

Reichard, Dean (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S842000, C029S843000

Reexamination Certificate

active

10434151

ABSTRACT:
An electronic component with bump electrodes includes a surface-protecting insulating film of adequate thickness and bump elements of adequate height, and allows the occurrence of open defects in the manufacturing process to be appropriately reduced. An electronic component with bump electrodes (X1) includes a substrate (11), electrode pads (12) provided on the substrate (11), an insulating film (13) that has openings (13a) in correspondence with the electrode pads (12) and is laminated and formed on the substrate (11), electroconductive connecting elements (14) provided on the electrode pads (12) in the openings (13a), and bump elements (15) that are in direct contact with the electroconductive connecting elements (14) and project from the openings (13a).

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