Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-04-10
2007-04-10
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S696000, C361S697000, C174S015100, C165S080400, C165S104330
Reexamination Certificate
active
10849759
ABSTRACT:
An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cold plate is in thermal communication with at least one of the computer components, and convectively removes heat from that component using a liquid coolant. A heat exchanger dissipates heat from the liquid coolant, and provides liquid coolant back to the cold plate. An air mover within the chassis cools the heat exchanger, blows air across other components needing cooling, and removes heated air from the chassis. The air mover may extend substantially across the chassis, or it may blow crosswise from an outlet-ventilating direction.
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Web Site: www.intel.com/design/servers/SR1350-E/SR1350e—brief.pdf, printed on Dec. 3, 2003, publication date unknown.
U.S. Appl. No. 10/772,115, filed Feb. 3, 2004, Applicants: Bash, Simon, and Malone.
Bash Cullen E.
Malone Christopher G.
Sharma Ratnesh K.
Simon Glenn C.
Chervinsky Boris
Hewlett--Packard Development Company, L.P.
Lange Richard P.
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