Thermal management arrangement with a low heat flux channel...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S699000, C361S718000, C165S080400, C165S104330, C257S714000, C257S715000

Reexamination Certificate

active

10869186

ABSTRACT:
Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels.

REFERENCES:
patent: 5998240 (1999-12-01), Hamilton et al.
patent: 6942018 (2005-09-01), Goodson et al.
patent: 7110258 (2006-09-01), Ding et al.
patent: 2003/0062149 (2003-04-01), Goodson et al.
Kandlikar, S. G., “A General Correlation for Saturated Two-Phase Flow Boiling Heat Transfer Inside Horizontal and Vertical Tubes,” Journal of Heat Transfer, Transactions of the ASME, Feb. 1990, vol. 112, pp. 219-228.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal management arrangement with a low heat flux channel... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal management arrangement with a low heat flux channel..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal management arrangement with a low heat flux channel... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3746907

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.