Optoelectronic component with encapsulant

Details Optoelectronic component with encapsulant Optoelectronic component with encapsulant

2007-04-24

2007-04-24

Le, Que T. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

C250S216000

Reexamination Certificate

active

11124775

ABSTRACT:
Provided are optoelectronic components which include a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant filling the trench frush to the front surface, wherein the encapsulant provides an optical surface.

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Hove et al.; 1999 Electronic Components and Technology Conference; Jun. 1-4, 1999, San Diego, California, pp. 1096-1102.

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