Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2007-05-01
2007-05-01
Graybill, David E. (Department: 2822)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S097200, C427S097600, C427S097700, C427S099200
Reexamination Certificate
active
10737974
ABSTRACT:
A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.
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Larnerd James M.
Lauffer John M.
Markovich Voya R.
Papathomas Kostas I.
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Graybill David E.
Hinman, Howard & Kattell LLP
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