Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2007-03-06
2007-03-06
Nasri, Javaid H. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
C439S342000
Reexamination Certificate
active
10514828
ABSTRACT:
An object of the present invention is to provide an electrode for high-density connection capable of attachment/detachment of a package or an FPC. In order to attain this object, a snap electrode according to the present invention has a tubular ring presenting a circular or polygonal section and at least one spring electrode provided in the ring and coupled to the ring, to be connected to a substrate or an FPC by holding a pin electrode of an insertion-mount type package or the FPC with the spring electrode. The snap electrode preferably consists of nickel or a nickel alloy or consists of copper or a copper alloy, and is preferably coated with a noble metal or conductive diamondlike carbon.
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“Retrospects and Prospects of Plating in the Electronics Industry”, Xia Chuanyi, vol. 33, No. 3 Jun. 1996, with English abstract.
McDermott Will & Emery LLP
Nasri Javaid H.
Sumitomo Electric Industries Ltd.
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