Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-05-29
2007-05-29
Lindsay, Jr., Walter (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S676000, C257S666000, C257S737000, C257S667000, C257S735000, C257SE23021, C257SE23031, C257SE23014
Reexamination Certificate
active
10988551
ABSTRACT:
A method of fabricating a lead frame for a semiconductor device having a semiconductor chip resin-sealed therein. The lead frame includes a lead to be electrically connected to the semiconductor chip within sealing resin and to be sealed into the sealing resin such that at least a part of its mounting surface is exposed from the sealing resin. The method includes a lead forming step for forming the lead, and a side edge coining step for subjecting a side edge of a sealed surface, which is a surface on the opposite side of the mounting surface, of the lead to coining processing from the side of the sealed surface, to form a slipping preventing portion. The slipping preventing portion is to project sideward from the lead and to have a slipping preventing surface between the mounting surface and the sealed surface of the lead.
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Lindsay, Jr. Walter
Rabin & Berdo P.C.
Rohm & Co., Ltd.
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