Methods and apparatus for electromechanically and/or...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S287000

Reexamination Certificate

active

10230970

ABSTRACT:
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and first and second electrodes spaced apart from each other and from the microelectronic substrate. A polishing medium is positioned between the electrodes and the support member and has a polishing surface positioned to contact the microelectronic substrate. At least a portion of the first and second electrodes can be recessed from the polishing surface. A liquid, such as an electrolytic liquid, can be provided in the recess, for example, through flow passages in the electrodes and/or the polishing medium. A variable electrical signal is passed from at least one of the electrodes, through the electrolyte and to the microelectronic substrate to remove material from the substrate.

REFERENCES:
patent: 2315695 (1943-04-01), Faust
patent: 2516105 (1950-07-01), der Mateosian
patent: 3239439 (1966-03-01), Helmke
patent: 3334210 (1967-08-01), Williams et al.
patent: 4839005 (1989-06-01), Katsumoto et al.
patent: 5098533 (1992-03-01), Duke et al.
patent: 5162248 (1992-11-01), Dennison et al.
patent: 5244534 (1993-09-01), Yu et al.
patent: 5300155 (1994-04-01), Sandhu et al.
patent: 5344539 (1994-09-01), Shinogi et al.
patent: 5562529 (1996-10-01), Kishii et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575885 (1996-11-01), Hirabayashi et al.
patent: 5618381 (1997-04-01), Doan et al.
patent: 5624300 (1997-04-01), Kishii et al.
patent: 5676587 (1997-10-01), Landers et al.
patent: 5681423 (1997-10-01), Sandhu et al.
patent: 5780358 (1998-07-01), Zhou et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5840629 (1998-11-01), Carpio
patent: 5843818 (1998-12-01), Joo et al.
patent: 5846398 (1998-12-01), Carpio
patent: 5863307 (1999-01-01), Zhou et al.
patent: 5888866 (1999-03-01), Chien
patent: 5897375 (1999-04-01), Watts et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5930699 (1999-07-01), Bhatia
patent: 5934980 (1999-08-01), Koos et al.
patent: 5952687 (1999-09-01), Kawakubo et al.
patent: 5954975 (1999-09-01), Cadien et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5972792 (1999-10-01), Hudson
patent: 5993637 (1999-11-01), Hisamatsu et al.
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6007695 (1999-12-01), Knall et al.
patent: 6010964 (2000-01-01), Glass
patent: 6024856 (2000-02-01), Haydu et al.
patent: 6033953 (2000-03-01), Aoki et al.
patent: 6039633 (2000-03-01), Chopra
patent: 6046099 (2000-04-01), Cadien et al.
patent: 6051496 (2000-04-01), Jang
patent: 6060386 (2000-05-01), Givens
patent: 6060395 (2000-05-01), Skrovan et al.
patent: 6063306 (2000-05-01), Kaufman et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6066559 (2000-05-01), Gonzalez et al.
patent: 6068787 (2000-05-01), Grumbine et al.
patent: 6083840 (2000-07-01), Mravic, et al.
patent: 6100197 (2000-08-01), Hasegawa
patent: 6103096 (2000-08-01), Datta et al.
patent: 6103628 (2000-08-01), Talieh
patent: 6103636 (2000-08-01), Zahorik, deceased et al.
patent: 6115233 (2000-09-01), Seliskar et al.
patent: 6117781 (2000-09-01), Lukanc et al.
patent: 6121152 (2000-09-01), Adams et al.
patent: 6132586 (2000-10-01), Adams et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6162681 (2000-12-01), Wu
patent: 6171467 (2001-01-01), Weihs et al.
patent: 6174425 (2001-01-01), Simpson et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6180947 (2001-01-01), Stickel et al.
patent: 6187651 (2001-02-01), Oh
patent: 6190494 (2001-02-01), Dow
patent: 6196899 (2001-03-01), Chopra et al.
patent: 6197182 (2001-03-01), Kaufman et al.
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6218309 (2001-04-01), Miller et al.
patent: 6250994 (2001-06-01), Chopra et al.
patent: 6259128 (2001-07-01), Adler et al.
patent: 6273786 (2001-08-01), Chopra et al.
patent: 6276996 (2001-08-01), Chopra
patent: 6280581 (2001-08-01), Cheng
patent: 6287974 (2001-09-01), Miller
patent: 6299741 (2001-10-01), Sun et al.
patent: 6303956 (2001-10-01), Sandhu et al.
patent: 6313038 (2001-11-01), Chopra et al.
patent: 6322422 (2001-11-01), Satou
patent: 6328632 (2001-12-01), Chopra
patent: 6368184 (2002-04-01), Beckage
patent: 6368190 (2002-04-01), Easter et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6395607 (2002-05-01), Chung
patent: 6416647 (2002-07-01), Dordi et al.
patent: 6455370 (2002-09-01), Lane
patent: 6461911 (2002-10-01), Ahn et al.
patent: 6464855 (2002-10-01), Chadda et al.
patent: 6852630 (2002-10-01), Basol et al.
patent: 6504247 (2003-01-01), Chung
patent: 6867136 (2003-06-01), Basol et al.
patent: 6620037 (2003-09-01), Kaufman et al.
patent: 6689258 (2004-02-01), Lansford et al.
patent: 6693036 (2004-02-01), Nogami et al.
patent: 6848970 (2004-03-01), Manens et al.
patent: 6722942 (2004-04-01), Lansford et al.
patent: 6722950 (2004-04-01), Dabral et al.
patent: 6736952 (2004-05-01), Emesh et al.
patent: 6753250 (2004-06-01), Hill et al.
patent: 6776693 (2004-08-01), Duboust et al.
patent: 6780772 (2004-08-01), Uzoh et al.
patent: 6893328 (2004-10-01), So
patent: 6846227 (2005-01-01), Sato et al.
patent: 6881664 (2005-04-01), Catabay et al.
patent: 2001/0025976 (2001-10-01), Lee
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2002/0025759 (2002-02-01), Lee et al.
patent: 2002/0025760 (2002-02-01), Lee et al.
patent: 2002/0025763 (2002-02-01), Lee et al.
patent: 2002/0052126 (2002-05-01), Lee et al.
patent: 2002/0070126 (2002-06-01), Sato et al.
patent: 2002/0104764 (2002-08-01), Banerjee et al.
patent: 2002/0115283 (2002-08-01), Ho et al.
patent: 2003/0064669 (2003-04-01), Basol et al.
patent: 2003/0178320 (2003-09-01), Liu et al.
patent: 2004/0192052 (2004-09-01), Mukherjee et al.
patent: 2004/0259479 (2004-12-01), Sevilla
patent: 2005/0059324 (2005-03-01), Lee et al.
patent: 2005/0133379 (2005-06-01), Basol et al.
patent: 2005/0173260 (2005-08-01), Basol et al.
patent: 2005/0178743 (2005-08-01), Manens et al.
patent: 0459397 (1991-12-01), None
patent: 0459397 (1991-12-01), None
patent: 1 123 956 (2001-08-01), None
patent: 1-241129 (1989-09-01), None
patent: 2001077117 (2001-03-01), None
patent: WO 00/26443 (2000-05-01), None
patent: WO 00/26443 (2000-05-01), None
patent: WO 00/28586 (2000-05-01), None
patent: WO 00/28586 (2000-05-01), None
patent: WO 00/32356 (2000-06-01), None
patent: WO 00/59008 (2000-10-01), None
patent: WO 00/59008 (2000-10-01), None
patent: WO 00/59682 (2000-10-01), None
patent: WO 02/064314 (2002-08-01), None
U.S. Appl. No. 09/651,779, filed Aug. 30, 2000, Moore.
U.S. Appl. No. 09/651,808, filed Aug. 30, 2000, Chopra et al.
U.S. Appl. No. 09/653,392, filed Aug. 31, 2000, Chopra et al.
U.S. Appl. No. 10/090,869, filed Mar. 4, 2002, Moore et al.
U.S. Appl. No. 10/230,463, filed Aug. 29, 2002, Lee et al.
U.S. Appl. No. 10/230,602, filed Aug. 29, 2002, Chopra.
U.S. Appl. No. 10/230,628, filed Aug. 29, 2002, Lee et al.
U.S. Appl. No. 10/230,972, filed Aug. 29, 2002, Lee et al.
U.S. Appl. No. 10/230,973, filed Aug. 29, 2002, Lee et al.
Frankenthal, R.P. and Eaton, D.H., “Electroetching of Platinum in the Titanium-Platinum-Gold Metallization on Silicon Integrated Circuits,” Journal of The Electrochemical Society, vol. 123, No.5, pp. 703-706, May 1976, Pennington, New Jersey.
Bernhardt, A.F., Contolini, R.J., Mayer, S.T., “Electrochemical Planarization for Multi-Level Metallization of Microcircuitry,” CircuiTree, vol. 8, No. 10, pp. 38, 40, 42, 44, 46, and 48, Oct. 1995.
McGraw-Hill, “Chemical bonding,” Concise Encyclopedia of Science & Technology, Fourth Edition, Sybil P. Parker, Editor in Chief, p. 367, McGraw-Hill, New York, New York, 1998.
PhysicsWorld, “Hard Materials”, http://physicsweb.org/box/world/11/1/11/world-11-1-11-1 (accessed Jul. 29, 2002), 1 page, excerpt of “Superhard superlattices,” S. Barnett and A. Madan, Physics World, Jan. 1998, Institute of Physics Publishing Ltd., Bristol, United Kingdom.
Huang, C.S. et

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods and apparatus for electromechanically and/or... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for electromechanically and/or..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for electromechanically and/or... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3738734

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.