Method of producing p-n junction type elements by ionized cluste

Metal treatment – Compositions – Heat treating

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148175, 357 20, 357 91, H01L 21265, H01L 754

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active

041207009

ABSTRACT:
A p-n junction type solid-state element having a substrate, a substrate electrode coated on the substrate, a p-n junction type semiconductor layer coated on the substrate having the substrate electrode thereon, and an upper terminal electrode coated on the p-n junction type semiconductor layer; in which the p-n junction type semiconductor layer is formd by coating an n-type (or p-type) semiconductor layer on the substrate having the substrate electrode thereon by the ion-plating method and then by forming a p-type (or n-type) semiconductor layer in the upper surface region of the n-type (or p-type) seminconductor layer by the ion-implantation method.

REFERENCES:
patent: 3433677 (1969-03-01), Robinson
patent: 3520741 (1970-07-01), Mankarious
patent: 3551213 (1970-12-01), Boyle
patent: 3908183 (1975-09-01), Ennis, Jr.
patent: 3912826 (1975-10-01), Kennedy
patent: 4066527 (1978-01-01), Takagi et al.
T. Takagi et al., "Ionized Cluster Beam Deposition", in Ion Implantation in Semiconductors, ed. S. Namba, Plenum; New York, 1974, p. 341.

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