Semiconductor apparatus

Details Semiconductor apparatus Semiconductor apparatus

2007-07-24

2007-07-24

Tran, Long K. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S777000, C257S778000, C257S723000, C361S760000, C361S761000, C361S790000

Reexamination Certificate

active

11300230

ABSTRACT:
A semiconductor apparatus includes a printed circuit board, a peripheral type first semiconductor package which has a first group of ball electrodes arranged in a peripheral type first arrangement area and a first group of additional ball electrodes arranged inside the first arrangement area and which is arranged on a first surface of the printed circuit board, and a peripheral type second semiconductor package which has a second group of ball electrodes arranged in a second arrangement area and a second group of additional ball electrodes arranged inside the second arrangement area and which is arranged on a second surface of the printed circuit board. A ball electrode located at at least one corner of the first group of ball electrodes is arranged at a position to oppose a corner of the second arrangement area, and at least one ball electrode of the second group of ball electrodes is arranged at a position to oppose the second group of additional ball electrodes through the printed circuit board.

REFERENCES:
patent: 6678167 (2004-01-01), Degani et al.
patent: 6747362 (2004-06-01), Barrow
patent: 7045901 (2006-05-01), Lin et al.
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 5-82937 (1993-04-01), None
patent: 9-162241 (1997-06-01), None
patent: 2001-326322 (2001-11-01), None

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