Wiring board, semiconductor device, and method of...

Details Wiring board, semiconductor device, and method of... Wiring board, semiconductor device, and method of...

2007-04-17

2007-04-17

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S698000, C257S699000, C257S777000, C257S778000

Reexamination Certificate

active

10203652

ABSTRACT:
A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers14connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5108541 (1992-04-01), Schneider et al.
patent: 5222014 (1993-06-01), Lin
patent: 5521435 (1996-05-01), Mizukoshi
patent: 5562973 (1996-10-01), Nagasaka et al.
patent: 5578526 (1996-11-01), Akram et al.
patent: 5629835 (1997-05-01), Mahulikar et al.
patent: 5640051 (1997-06-01), Tomura et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5668405 (1997-09-01), Yamashita
patent: 5821626 (1998-10-01), Ouchi et al.
patent: 5848466 (1998-12-01), Viza et al.
patent: 5886877 (1999-03-01), Shingai et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6107679 (2000-08-01), Noguchi
patent: 6262477 (2001-07-01), Mahulikar
patent: 6356453 (2002-03-01), Juskey et al.
patent: 6492699 (2002-12-01), Glenn et al.
patent: 6998344 (2006-02-01), Akram et al.
patent: 0657932 (1995-06-01), None
patent: 0702404 (1996-03-01), None
patent: 0751565 (1997-01-01), None
patent: 0768712 (1997-04-01), None
patent: 8-153747 (1996-06-01), None
patent: 9-46041 (1997-02-01), None
patent: 10-189801 (1998-07-01), None
patent: 11-145381 (1999-05-01), None
patent: 11-163207 (1999-06-01), None
patent: 11-340356 (1999-12-01), None
patent: 1998-042654 (1998-08-01), None
patent: 9422168 (1994-09-01), None
English Language Abstract JP 2000-183283.
English Language Abstract of JP 8-236694, Sep. 13, 1996.
English Language Abstract of JP 11-145381, May 28, 1999.
English Language Abstract of JP 4-280695, Jun. 10, 1992.
English Language Abstract of JP 8-330352, Dec. 13, 1996.
English Language Abstract of JP 2001-68810.
English Language Abstract of JP 9-46041, Feb. 14, 1997.
English Language Abstract of JP 11-163207, Jun. 18, 1999.
English Language Abstract of JP 10-214893, Aug. 17, 1998.
English Language Abstract of JP 10-189801, Jul. 21, 1998.
English Language Abstract of JP 8-153747, Nov. 6, 1996.
English Language Abstract of JP 11-340356, Oct. 12, 1999.

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