Method for varying the uniformity of a dopant as it is...

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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C438S514000, C257SE21135

Reexamination Certificate

active

11033939

ABSTRACT:
The present invention provides a method for placing a dopant in a substrate and a method for manufacturing an integrated circuit. The method for placing a dopant in a substrate, among other steps, includes providing a substrate (340) and implanting a dopant within the substrate (340) using an implant (370), the implant (370) moving at varying speeds across the substrate (340) to provide different concentrations of the dopant within the substrate (340).

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