Method of manufacturing terminal

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Reexamination Certificate

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Details

C029S883000

Reexamination Certificate

active

11199361

ABSTRACT:
In a terminal manufacturing method of the present invention, first a thin plate-like body including a thin plate-like terminal portion and a thin plate-like leg portion is formed with a die. The thin plate-like terminal portion has a shape corresponding to a terminal portion24of an upper-level terminal22and a terminal portion30of a lower-level terminal28. The thin plate-like leg portion has the shape corresponding to a leg portion26of the upper-level terminal22and a leg portion32of the lower-level terminal28. Then, the upper-level terminal22is formed by bending the thin plate-like leg portion toward one side of a plate-thickness direction. Also, the lower-level terminal28is formed by bending the thin plate-like leg portion toward the other side of the plate-thickness direction. Thus, by simply changing the bending direction of the thin plate-like leg portion, either the upper-level terminal22or the lower-level terminal28can be formed. According to the terminal manufacturing method of the invention, when the terminal includes a first terminal mounted in an upper-level mounting hole of a connector housing and a second terminal mounted in a lower-level mounting hole, these two terminals can share a blank material of the same type in common at the manufacturing stage thereof.

REFERENCES:
patent: 6505402 (2003-01-01), Moriwake et al.
patent: 6506063 (2003-01-01), Moriwake et al.
patent: 7086873 (2006-08-01), Nose et al.
patent: 2002/0192988 (2002-12-01), Droesbeke et al.
patent: 2004/0115971 (2004-06-01), Nose et al.
patent: 2005/0208795 (2005-09-01), Huang
patent: 2001-110491 (2001-04-01), None
patent: 2002-279685 (2002-09-01), None
patent: 2002-371236 (2002-12-01), None

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