Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-03-20
2007-03-20
Gray, Linda (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S268000, C156S101000, C029S592100, C083S875000, C083S852000, C083S880000, C225S002000, C225S096500
Reexamination Certificate
active
10920159
ABSTRACT:
To realize a method of manufacturing an electro-optical device, which is capable of completely dividing a plurality of substrates used for the electro-optical device along division lines, in a method of manufacturing the electro-optical device, two or more substrates used for electro-optical devices, which are adhered to each other, are divided along division lines. The method includes adhering, a first substrate and a second substrate, on whose one surface a plurality of grooves or a groove is formed in a predetermined width along a division line, to each other on the surface of the second substrate where the plurality of grooves or the one groove is formed and dividing generated cracks in the other surface of the first substrate, which is opposite to the surface adhered to the second substrate, along the division line to divide the first substrate and the second substrate that are adhered to each other. To realize a method of manufacturing an electro-optical device, which is capable of completely dividing a plurality of substrates used for the electro-optical device along division lines.
REFERENCES:
patent: 4275494 (1981-06-01), Kohyama et al.
patent: A 2001-147423 (2001-05-01), None
patent: A-2003-0036944 (2003-05-01), None
Gray Linda
Oliff & Berridg,e PLC
Seiko Epson Corporation
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