Method of manufacturing hard disc device with a printed...

Details Method of manufacturing hard disc device with a printed... Method of manufacturing hard disc device with a printed...

2007-07-10

2007-07-10

Gray, Linda (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S264000, C156S270000, C156S334000, C156S184000, C156S192000, C029S603060, C029S603070

Reexamination Certificate

active

11366553

ABSTRACT:
An insulating sheet is manufactured by attaching a buffer layer and a resin film using an adhesive layer that is not adhesive at a normal ambient temperature. Since there is no need to use a release liner when manufacturing the insulating sheet, there is no release of a silicone component. Accordingly, when installing a hard disk printed wiring board, the printed wiring board and electronic circuits inside the hard disk will not be damaged by the released silicone.

REFERENCES:
patent: 2528531 (1950-11-01), Marshall
patent: 6558791 (2003-05-01), Matsuura et al.
patent: 2001/0015484 (2001-08-01), Matsuura et al.
patent: 2004/0071989 (2004-04-01), Kumakura
patent: 0 644 560 (1995-03-01), None
patent: 62-231741 (1987-12-01), None
patent: U 63-171991 (1988-11-01), None
patent: A 3-114828 (1991-05-01), None
patent: 04-072370 (1992-03-01), None
patent: 07-268286 (1995-10-01), None
patent: 08-170688 (1996-07-01), None
patent: A 10-166489 (1998-06-01), None
patent: A 10-309769 (1998-11-01), None
patent: A 11-216790 (1999-08-01), None
patent: 2000-081084 (2000-03-01), None

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