Circuit board and its manufacturing method

Details Circuit board and its manufacturing method Circuit board and its manufacturing method

2007-04-03

2007-04-03

Dinh, Tuan (Department: 2841)

Metal working

Method of mechanical manufacture

Electrical device making

C174S262000, C361S792000

Reexamination Certificate

active

10250871

ABSTRACT:
A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a metal film for covering a through hole on at least one surface of an insulating substrate having the through hole filled with the conductive material. An uneven layer with a thickness of 5 μm or more is formed on a surface of the metal film, and a metal layer is formed on the opposite surface to the uneven layer.

REFERENCES:
patent: 4081601 (1978-03-01), Dinella et al.
patent: 4715117 (1987-12-01), Enomoto
patent: 4893404 (1990-01-01), Shirahata et al.
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5906042 (1999-05-01), Lan et al.
patent: 6217987 (2001-04-01), Ono et al.
patent: 6365843 (2002-04-01), Shirai et al.
patent: 6376052 (2002-04-01), Asai et al.
patent: 6440542 (2002-08-01), Kariya
patent: 6774316 (2004-08-01), Suzuki et al.
patent: 6930258 (2005-08-01), Kawasaki et al.
patent: 2003/0132025 (2003-07-01), Wakihara et al.
patent: 0 651 602 (1995-05-01), None
patent: 1075172 (2001-02-01), None
patent: 5-275830 (1993-10-01), None
patent: 10-56264 (1998-02-01), None
patent: 2001-168485 (2001-06-01), None
patent: 2001-177248 (2001-06-01), None
patent: 2001-284797 (2001-10-01), None
International Search Report corresponding to application No. PCT/JP02/11266 dated Jan. 28, 2003.

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