Substrate crack inspecting method, substrate crack...

Measuring and testing – Vibration – Resonance – frequency – or amplitude study

Reexamination Certificate

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C073S012010, C073S865600, C073S571000

Reexamination Certificate

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10965743

ABSTRACT:
Certain example embodiments of the present invention provide a method for detecting a substrate crack by simple equipment and steps. A substrate crack inspecting method may include the steps of (1) producing a sound by providing vibration to a substrate, (2) determining a power spectrum by capturing the produced sound and carrying out an acoustic analysis for the captured sound, and (3) judging whether or not a substrate crack exists based on a spectral intensity of a predetermined frequency region.

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Thierry Debelle, “Making Sound Measurements and Octave Analysis”, Aug. 18-20, 1999, National Instruments NIWeek, pp. 1-20, downloaded from www.natinst.com Jun. 14, 2004.
European Search Report Mailed May 11, 2005 in corresponding EP application No. 040224566.4-2004.
Patent Abstracts of Japan, vol. 2002, No. 10, Oct. 10, 2002 & JP 2002 166234 A (Sharp Corp), Jun. 11, 2002.

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