Electrode assembly for electrochemical processing of workpiece

Details Electrode assembly for electrochemical processing of workpiece Electrode assembly for electrochemical processing of workpiece

2007-03-27

2007-03-27

King, Roy (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S266000, C204S276000, C204S292000

Reexamination Certificate

active

10723045

ABSTRACT:
The present invention provides a novel system, apparatus, and method to deposit conductive films on a workpiece. A system for electroplating a surface of a workpiece using a process solution is disclosed. The system comprises a solution housing configured to house an electrode and to contain the process solution, a filter element disposed in the solution housing configured to partition the solution housing into a lower chamber and an upper chamber, and an upper inlet port coupled to the solution housing configured to deliver the process solution to the upper chamber of the solution housing to fill the upper chamber and the lower chamber immersing the electrode in the lower chamber.

REFERENCES:
patent: 3328273 (1967-06-01), Creutz et al.
patent: 4258316 (1981-03-01), Leif
patent: 4430173 (1984-02-01), Boudot et al.
patent: 4948474 (1990-08-01), Miljkovic
patent: 4954142 (1990-09-01), Carr et al.
patent: 4975159 (1990-12-01), Dahms
patent: 5084071 (1992-01-01), Nenadic et al.
patent: 5256565 (1993-10-01), Bernhardt et al.
patent: 5354490 (1994-10-01), Yu et al.
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5683564 (1997-11-01), Reynolds
patent: 5755859 (1998-05-01), Brusic et al.
patent: 5762544 (1998-06-01), Zuniga et al.
patent: 5770095 (1998-06-01), Sasaki et al.
patent: 5773364 (1998-06-01), Farkas et al.
patent: 5793272 (1998-08-01), Burghartz et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5840629 (1998-11-01), Carpio
patent: 5858813 (1999-01-01), Scherber et al.
patent: 5884990 (1999-03-01), Burghartz et al.
patent: 5897375 (1999-04-01), Watts et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5922091 (1999-07-01), Tsai et al.
patent: 5930669 (1999-07-01), Uzoh
patent: 5933753 (1999-08-01), Simon et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5976331 (1999-11-01), Chang et al.
patent: 5985123 (1999-11-01), Koon
patent: 6001235 (1999-12-01), Arken et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6017437 (2000-01-01), Ting et al.
patent: 6027631 (2000-02-01), Broadbent
patent: 6063506 (2000-05-01), Andricacos et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6071388 (2000-06-01), Uzoh
patent: 6074544 (2000-06-01), Reid et al.
patent: 6103085 (2000-08-01), Woo et al.
patent: 6106378 (2000-08-01), Perlov et al.
patent: 6113759 (2000-09-01), Uzoh
patent: 6132587 (2000-10-01), Jorne et al.
patent: 6136163 (2000-10-01), Cheung et al.
patent: 6156167 (2000-12-01), Patton et al.
patent: 6159354 (2000-12-01), Contolini et al.
patent: 6162344 (2000-12-01), Reid et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6193859 (2001-02-01), Contolini et al.
patent: 6244942 (2001-06-01), Zuniga
patent: 6261426 (2001-07-01), Uzoh et al.
patent: 6261433 (2001-07-01), Landau
patent: 6297155 (2001-10-01), Simpson et al.
patent: 6299741 (2001-10-01), Sun et al.
patent: 6365017 (2002-04-01), Hongo et al.
patent: 6527920 (2003-03-01), Mayer et al.
patent: 6695962 (2004-02-01), Uzoh et al.
patent: 2001/0017258 (2001-08-01), Ishida et al.
patent: 2001/0041526 (2001-11-01), Perlov et al.
patent: WO 98/27585 (1998-06-01), None
patent: WO 00/26443 (2000-05-01), None
James J. Kelly et al., “Leveling and Microstructural Effects of Additives for Copper Electrodeposition”, Journal of the Electrochemical Society, 146 (7), 1999, pp. 2540-2545, In U.S. Appl. No. 09/845,262.
Joseph M. Steigerwald et al., “Chemical Mechanical Planarization of Microelectronic Materials”, A Wiley-Interscience Publication, 1997, by John Wiley & Sons, Inc. pp. 212-222, In U.S. Appl. No. 09/845,262.
Robert D. Mikkola et al. “Investigation of the Roles of the Additive Components for Second Generation Copper Electroplating Chemistries Used for Advanced Interconnect Metalization”, 2000 IEEE, IEEE Electron Devices Society, pp. 117-119, U.S. Appl. No. 09/845,262.

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