Method of applying an encapsulant material to an ink jet...

Details Method of applying an encapsulant material to an ink jet... Method of applying an encapsulant material to an ink jet...

2006-10-17

2006-10-17

Feggins, K. (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

07121647

ABSTRACT:
A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.

REFERENCES:
patent: 4680859 (1987-07-01), Johnson
patent: 4935750 (1990-06-01), Hawkins
patent: 5435961 (1995-07-01), Micciche
patent: 5450113 (1995-09-01), Childers et al.
patent: 5478700 (1995-12-01), Gaynes et al.
patent: 5515089 (1996-05-01), Herko et al.
patent: 5538586 (1996-07-01), Swanson et al.
patent: 5539153 (1996-07-01), Schwiebert et al.
patent: 5596172 (1997-01-01), Raskin et al.
patent: 5627108 (1997-05-01), Alibocus et al.
patent: 5669970 (1997-09-01), Balog et al.
patent: 5736998 (1998-04-01), Caren et al.
patent: 5807606 (1998-09-01), Mould et al.
patent: 5905513 (1999-05-01), Brandon et al.
patent: 6010208 (2000-01-01), Powers et al.
patent: 6067709 (2000-05-01), Godin et al.
patent: 6076912 (2000-06-01), Murthy
patent: 6089151 (2000-07-01), Cobbley et al.
patent: 6098257 (2000-08-01), Koido et al.
patent: 6113216 (2000-09-01), Wong
patent: 6244696 (2001-06-01), Tran et al.
patent: 6253675 (2001-07-01), Mayer
patent: 6260957 (2001-07-01), Corley, Jr. et al.
patent: 6267472 (2001-07-01), Maher et al.
patent: 6290340 (2001-09-01), Kitahara et al.
patent: 6328423 (2001-12-01), Wong et al.
patent: 6361152 (2002-03-01), Fujisawa
patent: 6371017 (2002-04-01), Yamazaki et al.
patent: 6386434 (2002-05-01), Wong
patent: 6409312 (2002-06-01), Mrvos et al.
patent: 6439698 (2002-08-01), Patil
patent: 6495199 (2002-12-01), Kaiser et al.
patent: 6508170 (2003-01-01), Katsuoka et al.
patent: 6649403 (2003-11-01), McDevitt et al.
patent: 2001/0015744 (2001-08-01), Feinn et al.
patent: 2001/0043252 (2001-11-01), Feder et al.
patent: 2002/0051042 (2002-05-01), Takagi et al.
patent: 2002/0101482 (2002-08-01), Cook et al.
patent: 2002/0105562 (2002-08-01), Miyagawa et al.
patent: 2002/0128340 (2002-09-01), Young et al.
patent: 2002/0185482 (2002-12-01), Cobb et al.
patent: 2003/0097941 (2003-05-01), Rossmeisl et al.
patent: 2004/0089171 (2004-05-01), Jiang et al.
patent: 0867293 (1998-09-01), None
patent: 0867293 (1998-11-01), None
patent: 0888891 (1999-01-01), None

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