Silicone encapsulated devices

Details Silicone encapsulated devices Silicone encapsulated devices

1986-05-21

1988-01-19

Marquis, Melvyn I.

Stock material or miscellaneous articles

Composite

Of silicon containing

427 58, 528 15, 528 31, 528 32, 525478, 524786, 524862, B32B 904

Patent

active

047204311

ABSTRACT:
The addition of a low viscosity (2 to 100 centipoise) polysiloxane such as olydimethylsiloxane to a two-part heat curable polysiloxane system substantially eliminates the formation of bubbles when such system is employed as a potting compound for encapsulating devices such as electronic devices.

REFERENCES:
patent: 3677981 (1972-07-01), Wada et al.
patent: 3697473 (1972-10-01), Polmanteer et al.
patent: 4057596 (1977-11-01), Takamizawa et al.
patent: 4564562 (1986-01-01), Wong
patent: 4592959 (1986-06-01), Wong

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