Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2006-10-31
2006-10-31
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S464000, C083S861000
Reexamination Certificate
active
07129150
ABSTRACT:
A method of dividing a semiconductor wafer comprising:a bonding film adhering step of adhering a bonding film for die bonding to the back surface of the semiconductor wafer;a protective adhesive tape affixing step of affixing an extensible protective adhesive tape to the bonding film side of the semiconductor wafer having the bonding film on the back surface;a dividing step of dividing the semiconductor wafer affixed to the protective adhesive tape into individual semiconductor chips by applying a laser beam along the streets;a bonding film breaking step of breaking the bonding film for every semiconductor chip by extending the protective adhesive tape so as to give tensile force to the bonding film; anda semiconductor chip removing step of removing the semiconductor chips having the broken bonding film from the protective adhesive tape.
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Chambliss Alonzo
Disco Corporation
Smith , Gambrell & Russell, LLP
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