Chemical-mechanical polishing slurry for polishing metal films

Details Chemical-mechanical polishing slurry for polishing metal films Chemical-mechanical polishing slurry for polishing metal films

2006-12-12

2006-12-12

Webb, Gregory (Department: 1751)

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

C438S687000

Reexamination Certificate

active

07148189

ABSTRACT:
A slurry and related method for chemical mechanical polishing (CMP) of a metal film includes a solution containing at one halide ion and at least one halogen species which react with the metal film to form a surface layer on the film. The surface layer formed can be a metal halide layer. The surface layer can be removed by abrasive particles embedded in the polishing pad, or a thin inorganic layer coated on the polishing pad.

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