Microelectronic assembly having slidable contacts and method for

Details Microelectronic assembly having slidable contacts and method for Microelectronic assembly having slidable contacts and method for

1998-03-18

2000-04-04

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 29834, 257785, 257797, 361767, 361769, 361771, 361783, H05K 702, H05K 114, H01L 2312, H01L 23488

Patent

active

060469102

ABSTRACT:
A microelectronic assembly and a method for manufacturing the assembly include an integrated circuit component attached to a substrate via polymeric bodies. The integrated circuit component has bond pads that are bonded to corresponding conductive members. The substrate contains terminals associated with conductive traces. The conductive members rest against the respective terminals to form slidable electrical contacts. The slidable electrical contacts permit the transfer of electrical energy between the integrated circuit component and the conductive traces of the substrate. The polymeric bodies preferably comprise elastomers that are spaced from the conductive members, rather than underfilling the integrated circuit component.

REFERENCES:
patent: 3842189 (1974-10-01), Southgate
patent: 4056681 (1977-11-01), Cook, Jr.
patent: 4647959 (1987-03-01), Smith
patent: 4949148 (1990-08-01), Bartelink
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5302854 (1994-04-01), Nishiguchi et al.
patent: 5331513 (1994-07-01), Hirai et al.
patent: 5528461 (1996-06-01), Gore et al.
patent: 5657207 (1997-08-01), Schreiber et al.

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