Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1984-09-17
1986-11-11
Ozaki, George T.
Metal working
Method of mechanical manufacture
Assembling or joining
29577C, 29578, 29576B, 148187, H01L 21425
Patent
active
046214127
ABSTRACT:
A manufacturing method of a semiconductor device is disclosed which includes the steps of forming oxide layers on a major surface of a substrate at first and second portions, forming first and second semiconductor layers, each having predetermined conductivity types and with predetermined patterns on the oxide layers of the first and second portions, forming a first region by introducing an impurity of the first conductivity type into the substrate while using the first semiconductor layer as a mask, etching out the oxide layer on the second portion by using the second semiconductor layer as a mask, forming a second region by introducing an impurity of the second conductivity type into the substrate while using the second semiconductor layer as a mask, and forming oxide layers on the surfaces of the first semiconductor layer, the second semiconductor layer and the second region by a thermal oxidization process.
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Harada Yoshio
Kobayashi Kazuyoshi
Ozaki George T.
Sony Corporation
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