Packaged semiconductor device and method of manufacture...

Details Packaged semiconductor device and method of manufacture... Packaged semiconductor device and method of manufacture...

2006-08-01

2006-08-01

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S680000

Reexamination Certificate

active

07084488

ABSTRACT:
A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.

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