Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate
2006-11-14
2006-11-14
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
Applying or distributing fused filler
C228S214000, C228S037000, C228S059000
Reexamination Certificate
active
07134592
ABSTRACT:
Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connections of the component are thermally coupled to a protection apparatus during the soldering process, so that some of the heat which is introduced into the solder connections during the soldering process is passed to the protection apparatus. The protection apparatus also has a protection sleeve, which surrounds the component in places. The protection sleeve is advantageously composed of a thermally insulated material, and is provided with a coating with a high thermal reflection capability in places on its outer wall which faces away from the component.
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Notification of Reasons for Refusal (Japanese Office Action) dated May 19, 2006 with an English translation (Five (5) pages).
Correspondence dated Jul. 27, 2006 (Three (3) pages).
Ensslin Ulrich
Niemczyk Norbert
Crowell & Moring LLP
Daimler-Chrysler AG
Edmondson Lynne R.
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