Spacer for mounting a chip package to a substrate

Details Spacer for mounting a chip package to a substrate Spacer for mounting a chip package to a substrate

2006-10-10

2006-10-10

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S730000, C257S773000, C361S772000, C361S783000, C361S810000

Reexamination Certificate

active

07119430

ABSTRACT:
In a drive circuit for an electric motor, there is provided a circuit board, at least one semiconductor device mounted to the circuit board and a spacer. The semiconductor device has a semiconductor chip, a chip package incorporating therein the semiconductor chip and comprising a mounting member for mounting on the circuit board, and terminals for connections of the semiconductor chip to the circuit board. The spacer is interposed between the circuit board and the mounting member of the chip package so as to provide a space between the circuit board and the chip package.

REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5051870 (1991-09-01), Companion
patent: 5561323 (1996-10-01), Andros et al.
patent: 5633533 (1997-05-01), Andros et al.
patent: 5898575 (1999-04-01), Hawthorne et al.
patent: 5917703 (1999-06-01), Murphy
patent: 6535393 (2003-03-01), Akram et al.
patent: 8-2430 (1996-01-01), None

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