Critical dimension control using full phase and trim masks

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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C430S030000, C716S030000

Reexamination Certificate

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07122281

ABSTRACT:
To print sub-wavelength features on a wafer, a mask set including a full phase PSM (FPSM) and a corresponding trim mask can be used. Phase assignments on the FPSM can result in some feature definition with the trim mask, particularly in non-critical areas. Unfortunately, this limited feature definition can cause significant critical dimension (CD) variations in these non-critical areas. Undesirable critical dimension (CD) variations can be better controlled, even with substantial mask misalignment, by defining multiple feature edge portions with the trim mask in non-critical areas, such as T-intersections, elbows, and other types of intersecting lines.

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