Controlled thermal expansion composite and printed circuit board

Details Controlled thermal expansion composite and printed circuit board Controlled thermal expansion composite and printed circuit board

1981-11-30

1985-04-23

Lesmes, George F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428259, 174 685, B32B 700, D03D 300, H01B 1754

Patent

active

045130558

ABSTRACT:
A composite characterized by a controlled coefficient of thermal expansion and comprising a thermal coefficient control fabric embedded in a resin matrix and composed of yarns with positive and negative coefficients of thermal expansion. A composite circuit board constructed of the composite and having a coefficient of thermal expansion matched to a particular integrated chip carrier material, such as aluminum oxide.

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