Holding unit, processing apparatus and holding method of...

Cleaning and liquid contact with solids – Apparatus – With means to movably mount or movably support the work or...

Reexamination Certificate

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Details

C134S184000, C134S902000, C156S345140, C269S021000, C279S003000

Reexamination Certificate

active

07055535

ABSTRACT:
A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.

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