Method of manufacturing a wiring board

Details Method of manufacturing a wiring board Method of manufacturing a wiring board

2006-11-14

2006-11-14

Talbot, Brian K. (Department: 1762)

Coating processes

Electrical product produced

Wire conductor

C427S123000, C427S259000, C427S282000, C427S096100, C427S098400

Reexamination Certificate

active

07135204

ABSTRACT:
A method of manufacturing a wiring board is provided. The method includes performing a plating process to a land, in a condition that a resist film having an opening for exposing at least the center of the land is formed on a substrate with wires having the land formed thereon, so that a fist portion of an edge of the opening is disposed on the substrate and a second portion of the edge is disposed on the land.

REFERENCES:
patent: 5973931 (1999-10-01), Fukasawa
patent: 6441316 (2002-08-01), Kusui
patent: 6448504 (2002-09-01), Taguchi
patent: 6642615 (2003-11-01), Hashimoto et al.
patent: 6734557 (2004-05-01), Taniguchi et al.
patent: 2003/0080420 (2003-05-01), Ohara

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