Method of and mechanism for peeling adhesive tape bonded to...

Details Method of and mechanism for peeling adhesive tape bonded to... Method of and mechanism for peeling adhesive tape bonded to...

2006-06-13

2006-06-13

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S110000

Reexamination Certificate

active

07060593

ABSTRACT:
An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at least two adhering areas in the direction in which the adhesive tape is peeled. The porous member adheres to the semiconductor wafer by suction and fixes the wafer in place.

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