Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2006-08-22
2006-08-22
Owens, Douglas W (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Reexamination Certificate
active
07095100
ABSTRACT:
A semiconductor device and a method of making a semiconductor device are provided, wherein the device includes a die-pad, a semiconductor chip and a sealing resin. The die-pad has a first surface and a second surface opposite to the first surface. The second surface includes an exposed portion and a retreated portion around the exposed portion. The semiconductor chip is mounted on the first surface of the die-pad. The sealing resin covers the die-pad and the semiconductor chip, exposes the exposed portion, and is held in contact with the retreated portion.
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Owens Douglas W
Rohm & Co., Ltd.
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