Semiconductor device and method of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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Reexamination Certificate

active

07095100

ABSTRACT:
A semiconductor device and a method of making a semiconductor device are provided, wherein the device includes a die-pad, a semiconductor chip and a sealing resin. The die-pad has a first surface and a second surface opposite to the first surface. The second surface includes an exposed portion and a retreated portion around the exposed portion. The semiconductor chip is mounted on the first surface of the die-pad. The sealing resin covers the die-pad and the semiconductor chip, exposes the exposed portion, and is held in contact with the retreated portion.

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