Silicone pads for electronics thermal management

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

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C524S430000, C528S015000, C528S031000, C528S032000, C525S478000, C525S479000

Reexamination Certificate

active

07119143

ABSTRACT:
A method of choosing a formulation for a carrier free pad having desired thermal conductivity and elastomeric properties therein which will produce a pad having a desirable thermal impedance. A combination of a vinyl functional fluid, hydrogen capped polysiloxane, cross linker and powder in the form of heat conductive particles with or without electrically insulating particles is utilized which is variable according to the desired thickness, elastomeric and thermal characteristics of the pad. Inhibitors and catalysts may be utilized to control reaction rate. The formulation enables one to more efficiently arrive at a final formulation for a thermal pad having the desired performance characteristics according to the job at hand.

REFERENCES:
patent: 5679457 (1997-10-01), Bergerson
patent: 6096414 (2000-08-01), Young
patent: 2002/0143092 (2002-10-01), Matayabas, Jr.
patent: 2003/0049466 (2003-03-01), Yamada et al.
K.C. Abrasive Company, LLC, “Duralum CR3” specification sheet, effective date Jan. 01, 2002.
Basf Corporation, “Masil SF 201 Vinyl Functional Fluid” technical bulletin, 2002.
Basf Corporation, “Masil SF 305 Hydrogen Capped Polysiloxane” technical bulletin, 2002.
Basf Corporation, “Masil XL-1 Cross Linker” technical bulletin, 2002.
Anderson & Associates, LLC, “ANDISIL 2827-186L Fluid” specification sheet.
Anderson & Associates, LLC, “Catalyst 512” technical data sheet, May 2001.

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