Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-02-21
2006-02-21
Mai, Anh Duy (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S725000, C257S760000
Reexamination Certificate
active
07002256
ABSTRACT:
A semiconductor device including a semiconductor substrate having a grid-line area and a chip area, the chip area having a circuit area and a dummy area surrounding the circuit area, circuit patterns formed on the substrate in the circuit area, a first dummy pattern which is formed of the same material as the circuit pattern, formed in the dummy area, the dummy pattern encompassing the circuit area, a first insulating layer formed on an entire surface of the semiconductor substrate, a second insulating layer formed only on the first insulating layer which is formed on the semiconductor substrate and on the circuit patterns; and a third insulating layer formed on the exposed first insulating layer and the second insulating layer.
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S. Nakao et al., 0.32 Micron Pitch On-Grid Random Line Pattern Formation by Dense Dummy Pattern and Double Exposure in KrF Wavelength. IEDM 1999, pp. 98-99.
Duy Mai Anh
Mimura Junichi
Oki Electric Industry Co. Ltd.
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