Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2006-12-26
2006-12-26
Smith, Zandra V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S687000, C257S724000
Reexamination Certificate
active
07154189
ABSTRACT:
A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
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Notice of Reasons of Rejection for Patent Application No. 2000-380645, Mailing No. 260676, Mailing Date: Aug. 6, 2002.
Arai Yoshiyuki
Homma Hajime
Kawabata Takeshi
Maeda Kenji
Naraoka Hiroki
Nixon & Peabody LLP.
Perkins Pamela E
Smith Zandra V.
Studebaker Donald R.
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