Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-08-15
2006-08-15
Soward, Ida M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S278000, C257S706000, C257S712000, C257S714000, C257S715000, C257S716000, C257S717000, C257S721000, C257SE23080, C257SE23082, C257SE23097, C257SE23098, C257SE23099, C257SE23101
Reexamination Certificate
active
07091604
ABSTRACT:
A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more electrically connected integrated circuits, separated by a cooling channel.
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Busta Heinz H.
Schroeder David J.
Steckenrider J. Scott
Wang Yuchun
Wylie Ian W.
Cabot Microelectronics Corporation
Soward Ida M.
Weseman Steven D.
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