Method of manufacturing an ink jet print head

Etching a substrate: processes – Forming or treating thermal ink jet article

Reexamination Certificate

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Details

C216S002000, C216S041000, C029S890010, C347S065000, C347S068000, C347S070000

Reexamination Certificate

active

07153442

ABSTRACT:
A method of manufacturing an ink jet print head is provided. The method forms, on a silicon monocrystailine substrate, a first etching pattern for forming pressure generating chambers and a second etching pattern located opposite to the first etching pattern with respect to ink supply ports. The second etching pattern is narrower than the first etching pattern and is located within opposite lines defining the first etching pattern. The method also anisotropically etches the silicon monocrystailline from the surface thereof, on which the first and second etching patterns are formed, to the other surface thereof and anisotropically etches areas of the silicon monocrystalline substrate. Also, each of the areas is located between the first and second etching patterns, to a depth suitable for the ink supply ports.

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